Applications

Whether it’s outer space re-entry or palm top computer electronics, the resin technologies and processing knowledge that have evolved TenCate Advanced Composites Technologies into a leading manufacturer of specialty composite materials for the aerospace industry are now available to the microelectronics and semiconductor packaging industry. As power demands of semiconductors increase, so do the requirements for unique thermal management solutions. TenCate Advanced Composites’s thermal conductivity materials play a very important role in many heat sinking applications where efficient heat transfer is a relevant performance issue.

TenCate Advanced Composites thermally conductive adhesives, underfill/encapsulants, and molding compounds possess thermal properties that exceed many competitive products. Available in a variety of easy-to-use formats, including prepregs, adhesive films, liquids and pastes, these materials feature high thermal conductivity, low moisture absorption and controlled thermal expansion characteristics. For a reliable, leading edge thermal solution to many unique semiconductor packaging applications, team up with TenCate Advanced Composites – we know what it takes to manage heat.